Capability parameter

1. Minimum aperture: 0.125mm@ thickness 3.0mm, 0.15mm@ thickness 4.0mm；;

2. Thickness-diameter ratio of electroplating: ≤ 27:1

3. Thickness of finished product: ≤ 4.0mm.

4. Material: non-high frequency material

5. Copper thickness of hole wall: 18umMin, 20umAVG

design feature

Material: M6G

2. Number of floors: 22L

3. Thickness: 3.0mm

4. Diameter of mechanical drilling: 0.125mm

5. Ratio of thickness to diameter: 24:1

6. Electroplating TP: > 80%

application area

Data communication, computing server, semiconductor testing