Boss copper substrate


Miracle Technology (Guangdong) Co.,LTD
Tel:+86 15920215590
Tel:+86 15625136882

Product details

Technical parameters:


1. Bonding of FR4 material and copper-based boss


3. The maximum pressing plate thickness is 5.0mm


2. NPTH+PTH hole design


3. Height tolerance of boss is ±25um.


4. Forming: milling +V-cut.


Design features:


IT180A substrate+boss copper-based pressing


2. The thickness of copper substrate is 4.0mm


3. The height of the boss is 0.17mm+/-0.025mm.


4, 1.80mm nonmetallic hole


5, using forming +V-cut plate.


Application field:


Products with high reliability and high heat dissipation requirements.