Technical parameters:

1. There is no residual glue on the ceramic copper surface.

2. Bury ceramic blocks in L2-11

3、IPC-TM-650 Class3

4, ceramic and PCB flatness +/-25um

5, -40C/30min~140C/30min,1000 cycles

Design features:

12L HDI(1+10+1)

2, 0.4mm POFV design

3. The thickness of titanium layer is about 100nm.

4. Titanium removal process is needed after ceramic block wiring.

5, ceramic specifications 6*30*1.2mm, embedded in L2-11.

Application field:

laser radar