Technical parameters:

1. Mixed pressing of high-speed materials and flat buried copper foil

2, 2 order HDI+ planar buried resistance process

3. Special etching of Ni-P layer of buried copper foil

4. The square resistance is 10-250 ohms.

5. Tolerance of square resistance is +/-10%

Design features:

1. Secondary pressing of R5775 material and second-order HDI structure.

2. Lamination of L5 layers of Ohmega-ply copper foil

3. The buried resistance layer adopts the process of acid etching+special etching+alkali etching.

4. Special compensation for square resistance line width

application area

Aerospace military industry, communication equipment