Technical parameters:

Thickness capacity: 1.0mm

2. Minimum aperture: 0.1mm

3. Minimum mechanical hole: 0.15mm

4. Laser hole: 0.1mm

5. Dielectric layer thickness: 70um

Design features:

1. Interconnection of any layer

2. High-speed materials: M8U and EM892K2

3, 1/3 Oz copper foil

4、Pitch 0.5mm

5, reliability, floating tin x9, IRx9, CAF, Pass

Application field:

Optical module, high-speed connection product