technical competence

1. Z-direction interconnection N+M+N structure

2. The thickness of daughter board is 0.3-3.0mm

3. Sintered layer material EM890

4、Pitch ≥0.60mm

5. The sintering pore size is 0.175-0.275 mm.

6. The dielectric thickness of the sintered layer is 0.05-0.10mm

design feature

20L(6+8+6)

2. Material EM890

3. 7 times of pressing, electroplating and drawing transfer process

4. Processing scheme: it is divided into three PCBs, including two 6LHDI (2+2+2) and one 8HLC, which are interconnected by copper paste sintering.

application area

high performance computer